Invention Grant
- Patent Title: Circuit board with spaces for embedding components
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Application No.: US17566397Application Date: 2021-12-30
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Publication No.: US11664360B2Publication Date: 2023-05-30
- Inventor: Quang Nguyen , Christopher Glancey , Shams U Arifeen , Koustav Sinha
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H05K1/18 ; H01L23/00 ; H01L25/00 ; H05K3/34 ; H05K1/02 ; H05K3/00
Abstract:
Various embodiments described herein provide for printed circuit boards with one or more spaces for embedding components, which can be used to implement a memory sub-system.
Public/Granted literature
- US20220122958A1 CIRCUIT BOARD WITH SPACES FOR EMBEDDING COMPONENTS Public/Granted day:2022-04-21
Information query
IPC分类:
