中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

37 records (took 0.018 seconds)

    Semiconductor devices with reinforced substrates
    1.
    发明授权
    Semiconductor devices with reinforced substrates 有权

    公开(公告)号：US12218079B2

    公开(公告)日：2025-02-04

    申请号：US18151029

    申请日：2023-01-06

    Applicant: Micron Technology, Inc.

    Inventor： Koustav Sinha ,  Shams U. Arifeen ,  Christopher Glancey

    IPC: H01L23/00 ,  H01L21/48 ,  H01L23/16 ,  H01L23/31 ,  H01L23/498

    Abstract: Semiconductor devices having reinforcement structures configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a semiconductor die and a substrate coupled to the semiconductor die. The substrate can include a base structure and a reinforcement structure at least partially within a die shadow region of the substrate. The reinforcement structure can be at least partially surrounded by the base structure. The reinforcement structure has a higher stiffness than the base structure.

    SOLDER MASK FAULT FIBER OPTICS SENSOR
    3.
    发明公开
    SOLDER MASK FAULT FIBER OPTICS SENSOR 审中-公开

    公开(公告)号：US20240284590A1

    公开(公告)日：2024-08-22

    申请号：US18436892

    申请日：2024-02-08

    Applicant: Micron Technology, Inc.

    Inventor： Chan H. Yoo ,  James M. Derderian ,  Walter L. Moden ,  Christopher Glancey

    IPC: H05K1/02 ,  G01R31/309 ,  H05K3/28

    CPC classification number: H05K1/0269 ,  G01R31/309 ,  H05K3/28

    Abstract: Aspects of the present disclosure configure a processor to detect faults in a printed circuit board (PCB) solder mask using an optical waveguide. The processor directs an optical beam to an input of one or more optical waveguides embedded in a protective coating layer of a PCB, the protective coating layer being adjacent to one or more traces of the PCB. The processor measures a beam characteristic of the optical beam that is output by the one or more optical waveguides. The processor detects a disruption of the optical beam that is output by the one or more optical waveguides based on the beam characteristic. The processor detects a fault in the protective coating layer of the PCB based on detecting the disruption of the optical beam that is output by the one or more optical waveguides.

    SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND ASSOCIATED SYSTEMS AND METHODS
    4.
    发明申请
    SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND ASSOCIATED SYSTEMS AND METHODS 有权

    公开(公告)号：US20220344295A1

    公开(公告)日：2022-10-27

    申请号：US17236499

    申请日：2021-04-21

    Applicant: Micron Technology, Inc.

    Inventor： Shams U. Arifeen ,  Quang Nguyen ,  Christopher Glancey ,  Koustav Sinha ,  Chan H. Yoo

    IPC: H01L23/00

    Abstract: Semiconductor devices having interconnect structures with conductive elements configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a semiconductor die and a pillar structure coupled to the semiconductor die. The pillar structure can include a plurality of conductive elements made of a first conductive material having a first elastic modulus. The pillar structure can further include a continuous region of a second conductive material at least partially surrounding the plurality of conductive elements. The second conductive material can have a second elastic modulus less than the first elastic modulus.

    STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUBSTRATE HEAT SINKS AND ASSOCIATED SYSTEMS AND METHODS
    5.
    发明申请
    STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUBSTRATE HEAT SINKS AND ASSOCIATED SYSTEMS AND METHODS 有权

    公开(公告)号：US20220028826A1

    公开(公告)日：2022-01-27

    申请号：US16937861

    申请日：2020-07-24

    Applicant: Micron Technology, Inc.

    Inventor： Shams U. Arifeen ,  Christopher Glancey ,  Koustav Sinha

    IPC: H01L25/065 ,  H01L23/367 ,  H01L23/373

    Abstract: Stacked semiconductor die assemblies with heat sinks and associated methods and systems are disclosed. In some embodiments, a controller carrying one or more memory dies may be attached to a front side of a substrate. The substrate may include a heat sink formed on its back side such that the heat sink can establish a thermal contact with the controller. Further, the heat sink may be coupled to a thermally conductive pad of a printed circuit board (PCB) that carries the substrate. In this manner, the controller may be provided with a heat path toward the PCB to dissipate thermal energy generated during operation. In some cases, the substrate may include a set of thermal vias extending from the heat sink toward the controller to enhance the thermal contact between the controller and the heat sink.

    Semiconductor devices with reinforced substrates
    10.
    发明授权
    Semiconductor devices with reinforced substrates 有权

    公开(公告)号：US11552029B2

    公开(公告)日：2023-01-10

    申请号：US17013321

    申请日：2020-09-04

    Applicant: Micron Technology, Inc.

    Inventor： Koustav Sinha ,  Shams U. Arifeen ,  Christopher Glancey

    IPC: H01L23/00 ,  H01L23/16 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

    Abstract: Semiconductor devices having reinforcement structures configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a semiconductor die and a substrate coupled to the semiconductor die. The substrate can include a base structure and a reinforcement structure at least partially within a die shadow region of the substrate. The reinforcement structure can be at least partially surrounded by the base structure. The reinforcement structure has a higher stiffness than the base structure.

Patent Agency Ranking