Invention Grant
- Patent Title: Thermal emitter with embedded heating element
-
Application No.: US17199211Application Date: 2021-03-11
-
Publication No.: US11668683B2Publication Date: 2023-06-06
- Inventor: Christoph Glacer , Stefan Barzen , Matthias Reinwald
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Priority: EP 172220 2020.04.29
- Main IPC: G01N29/24
- IPC: G01N29/24 ; G01N25/00 ; G01N29/02 ; H05B3/14 ; H05B3/28 ; G02B5/00

Abstract:
A thermal emitter includes a freestanding membrane supported by a substrate, wherein the freestanding membrane includes in a lateral extension a center section, a conductive intermediate section and a border section, wherein the conductive intermediate section laterally surrounds the center section and is electrically isolated from the center section, the conductive intermediate section including a conductive semiconductor material that is encapsulated in an insulating material, wherein the border section at least partially surrounds the intermediate section and is electrically isolated from the conductive intermediate section, and wherein a perforation is formed through the border section.
Public/Granted literature
- US20210341433A1 Thermal Emitter With Embedded Heating Element Public/Granted day:2021-11-04
Information query