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公开(公告)号：US11905167B2
公开(公告)日：2024-02-20
申请号：US17932409
申请日：2022-09-15
发明人： Wolfgang Klein , Evangelos Angelopoulos , Stefan Barzen , Marc Fueldner , Stefan Geissler , Matthias Friedrich Herrmann , Ulrich Krumbein , Konstantin Tkachuk , Giordano Tosolini , Juergen Wagner
CPC分类号： B81C1/00158 , B81B3/0021 , B81B7/02 , B81C1/00103 , H04R1/08 , H04R7/02 , H04R7/08 , H04R31/003 , B81B2201/0257 , B81B2203/0127 , B81B2203/0384 , B81C2201/013 , H04R2201/003
摘要： A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.
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公开(公告)号：US20230002219A1
公开(公告)日：2023-01-05
申请号：US17932409
申请日：2022-09-15
发明人： Wolfgang Klein , Evangelos Angelopoulos , Stefan Barzen , Marc Fueldner , Stefan Geissler , Matthias Friedrich Hermann , Ulrich Krumbien , Konstantin Tkachuk , Giordano Tosolini , Juergen Wagner
摘要： A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.
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公开(公告)号：US11524891B2
公开(公告)日：2022-12-13
申请号：US17151392
申请日：2021-01-18
发明人： Wolfgang Klein , Evangelos Angelopoulos , Stefan Barzen , Marc Fueldner , Stefan Geissler , Matthias Friedrich Herrmann , Ulrich Krumbein , Konstantin Tkachuk , Giordano Tosolini , Juergen Wagner
摘要： A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.
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公开(公告)号：US11470426B2
公开(公告)日：2022-10-11
申请号：US16537308
申请日：2019-08-09
发明人： Arnaud Walther , Stefan Barzen , Wolfgang Klein , Johann Strasser
摘要： A micro electrical mechanical systems (MEMS) device includes a flexible membrane disposed over a substrate, and a first backplate disposed over the flexible membrane. The first backplate includes a first plurality of bumps facing the flexible membrane. The MEMS device further includes a plurality of features disposed at the flexible membrane, where each of the plurality of features being associated with a corresponding one of the first plurality of bumps.
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公开(公告)号：US10244316B2
公开(公告)日：2019-03-26
申请号：US15728045
申请日：2017-10-09
发明人： Stefan Barzen
摘要： According to an embodiment, a method of operating a speaker with an acoustic pump includes generating a carrier signal having a first frequency by exciting the acoustic pump at the first frequency and generating an acoustic signal having a second frequency by adjusting the carrier signal. In such embodiments, the first frequency is outside an audible frequency range and the second frequency is inside the audible frequency range. Adjusting the carrier signal includes performing adjustments to the carrier signal at the second frequency. Other embodiments include corresponding systems and apparatus, each configured to perform corresponding embodiment methods.
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公开(公告)号：US10171925B2
公开(公告)日：2019-01-01
申请号：US15452058
申请日：2017-03-07
发明人： Alfons Dehe , Stefan Barzen
摘要： A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.
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公开(公告)号：US10034100B2
公开(公告)日：2018-07-24
申请号：US15290877
申请日：2016-10-11
发明人： Alfons Dehe , Stefan Barzen , Marc Fueldner
摘要： A sound transducer structure includes a membrane and a counter electrode. The membrane includes a first main surface in a sound transducing region made of a membrane material, and an edge region. The counter electrode includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. A plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume. The membrane and the counter electrode are arranged to provide a capacity therebetween. The membrane comprises a corrugation groove extending in the sound transducing region from the first main surface of the membrane into the free volume.
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公开(公告)号：US20170297899A1
公开(公告)日：2017-10-19
申请号：US15629834
申请日：2017-06-22
发明人： Alfons Dehe , Stefan Barzen , Ulrich Krumbein , Wolfgang Friza , Wolfgang Klein
CPC分类号： B81B3/0072 , B81B2203/0109 , B81C1/00325
摘要： A method for forming a microelectromechanical device may provide forming a first layer at least one of in or over a semiconductor carrier; forming a second layer at least one of in or over at least a central region of the first layer, such that a peripheral region of the first layer is at least partially free of the second layer; removing material under at least a central region of the second layer to release at least one of the central region of the second layer or a central region of the first layer; and/or removing material under at least the peripheral region of the first layer to such that the second layer is supported by the semiconductor carrier via the first layer.
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公开(公告)号：US20170247245A1
公开(公告)日：2017-08-31
申请号：US15054310
申请日：2016-02-26
发明人： Alfons Dehe , Stefan Barzen , Ulrich Krumbein , Wolfgang Friza , Wolfgang Klein
CPC分类号： B81B3/0072 , B81B2203/0109 , B81C1/00325
摘要： A microelectromechanical device may include: a semiconductor carrier; a microelectromechanical element disposed in a position distant to the semiconductor carrier; wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal; at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element; and a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier.
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公开(公告)号：US09745188B1
公开(公告)日：2017-08-29
申请号：US15054310
申请日：2016-02-26
发明人： Alfons Dehe , Stefan Barzen , Ulrich Krumbein , Wolfgang Friza , Wolfgang Klein
CPC分类号： B81B3/0072 , B81B2203/0109 , B81C1/00325
摘要： A microelectromechanical device may include: a semiconductor carrier; a microelectromechanical element disposed in a position distant to the semiconductor carrier; wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal; at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element; and a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier.
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