Invention Grant
- Patent Title: Wiring harness assembly having multiple separated conductors embedded within a substrate
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Application No.: US17688252Application Date: 2022-03-07
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Publication No.: US11670434B2Publication Date: 2023-06-06
- Inventor: Jared Bilas , David R. Peterson , Kurt P. Seifert , Christopher G. Reider , Doyeon Y. Sohn , Gerald A. Rhinehart, Jr. , Therese G. Stevens , George A. Drew , John T. Kightlinger
- Applicant: Aptiv Technologies Limited
- Applicant Address: BB St. Michael
- Assignee: APTIV TECHNOLOGIES LIMITED
- Current Assignee: APTIV TECHNOLOGIES LIMITED
- Current Assignee Address: BB St Michael
- Agency: Billion & Armitage
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01B7/02 ; H01B13/00 ; H01B13/012 ; H01B13/24 ; H01B7/36 ; H01B7/40 ; H01R27/02 ; H01R13/502 ; H01R12/67 ; B60R16/02 ; B33Y80/00 ; H01R12/59 ; B29C64/10 ; B29C64/106 ; B33Y10/00 ; H05K3/00 ; B33Y30/00 ; H01R13/52

Abstract:
A method of manufacturing a wiring harness assembly includes the steps of forming a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, forming an opening in the substrate located and sized such that a section of the plurality of electrically conductive wires is exposed within the opening, disposing a support segment within the opening, securing a connector segment including a plurality of terminals to the support segment, and placing the plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires.
Public/Granted literature
- US20220189656A1 WIRING HARNESS ASSEMBLY HAVING MULTIPLE SEPARATED CONDUCTORS EMBEDDED WITHIN A SUBSTRATE Public/Granted day:2022-06-16
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