Invention Grant
- Patent Title: Photosensitive compound, photosensitive composition, and patterning method
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Application No.: US17481961Application Date: 2021-09-22
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Publication No.: US11675266B2Publication Date: 2023-06-13
- Inventor: Yao-Jheng Huang , Te-Yi Chang , Chin-Hua Chang , Ming-Tzung Wu , Yu-Ying Hsu
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: C07C309/76
- IPC: C07C309/76 ; G03F7/031 ; G03F7/032
Abstract:
A patterning method includes providing a photosensitive composition on a material layer. The photosensitive composition includes one part by weight of a photo sensitive compound, 1.5 to 8 parts by weight of a resin, and 10 to 40 parts by weight of a diluent. The photosensitive compound has a chemical structure of
The patterning method further includes removing the diluent in the photosensitive composition to form a photoresist layer, exposing the photoresist layer, and removing an exposed part of the photoresist layer to expose a part of the material layer.
The patterning method further includes removing the diluent in the photosensitive composition to form a photoresist layer, exposing the photoresist layer, and removing an exposed part of the photoresist layer to expose a part of the material layer.
Public/Granted literature
- US20220334480A1 PHOTOSENSITIVE COMPOUND, PHOTOSENSITIVE COMPOSITION, AND PATTERNING METHOD Public/Granted day:2022-10-20
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