公开(公告)号：US11675266B2

公开(公告)日：2023-06-13

申请号：US17481961

申请日：2021-09-22

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yao-Jheng Huang ,  Te-Yi Chang ,  Chin-Hua Chang ,  Ming-Tzung Wu ,  Yu-Ying Hsu

IPC: C07C309/76 ,  G03F7/031 ,  G03F7/032

CPC classification number: G03F7/031 ,  C07C309/76 ,  G03F7/032 ,  C07C2603/24

Abstract: A patterning method includes providing a photosensitive composition on a material layer. The photosensitive composition includes one part by weight of a photo sensitive compound, 1.5 to 8 parts by weight of a resin, and 10 to 40 parts by weight of a diluent. The photosensitive compound has a chemical structure of




The patterning method further includes removing the diluent in the photosensitive composition to form a photoresist layer, exposing the photoresist layer, and removing an exposed part of the photoresist layer to expose a part of the material layer.