- 专利标题: Method for pitch split patterning using sidewall image transfer
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申请号: US16916452申请日: 2020-06-30
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公开(公告)号: US11676817B2公开(公告)日: 2023-06-13
- 发明人: Akiteru Ko , Richard Farrell
- 申请人: Tokyo Electron Limited
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L21/033
- IPC分类号: H01L21/033 ; G03F7/09 ; G03F7/11 ; G03F7/20 ; G03F7/26 ; H01L21/027
摘要:
A method of forming a device includes forming a hard mask layer over an underlying layer of a substrate, forming an anti-reflective coating layer over the hard mask layer, forming a patterned resist layer over the anti-reflective coating layer, and forming a mandrel including the anti-reflective coating layer by patterning the anti-reflective coating layer using the patterned resist layer as an etch mask. The method includes forming a sidewall spacer on the mandrel including the anti-reflective coating layer, forming a freestanding spacer on the hard mask layer by removing the mandrel from the anti-reflective coating layer, and using the freestanding spacer as an etch mask, patterning the underlying layer of the substrate.
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