Invention Grant
- Patent Title: Method for metal gate cut and structure thereof
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Application No.: US17809847Application Date: 2022-06-29
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Publication No.: US11676819B2Publication Date: 2023-06-13
- Inventor: Pei-Yu Wang , Zhi-Chang Lin , Ching-Wei Tsai , Kuan-Lun Cheng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- The original application number of the division: US16366511 2019.03.27
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/66 ; H01L29/40 ; H01L29/10 ; H01L27/092 ; H01L29/786 ; H01L21/28 ; H01L21/8234 ; H01L21/3213 ; H01L21/3105

Abstract:
A semiconductor device includes a first fin, a second fin, a first gate electrode having a first portion that at least partially wraps around an upper portion of the first fin and a second portion that at least partially wraps around an upper portion of the second fin, a second gate electrode having a portion that at least partially wraps around the upper portion of the first fin, and a gate-cut feature having a first portion in the first gate electrode between the first and second portions of the first gate electrode. The gate-cut feature is at least partially filled with one or more dielectric materials. In a direction of a longitudinal axis of the first fin, the gate-cut feature has a second portion extending to a sidewall of the second gate electrode.
Public/Granted literature
- US20220336220A1 METHOD FOR METAL GATE CUT AND STRUCTURE THEREOF Public/Granted day:2022-10-20
Information query
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