Invention Grant
- Patent Title: Thermoelectric coolers combined with phase-change material in integrated circuit packages
-
Application No.: US16355596Application Date: 2019-03-15
-
Publication No.: US11676883B2Publication Date: 2023-06-13
- Inventor: Javed Shaikh , Je-Young Chang , Kelly Lofgreen , Weihua Tang , Aastha Uppal
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- Main IPC: H01L23/38
- IPC: H01L23/38 ; H01L35/10 ; H01L35/30 ; H01L35/18 ; H01L35/16
Abstract:
An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.
Public/Granted literature
- US20200294884A1 THERMOELECTRIC COOLERS COMBINED WITH PHASE-CHANGE MATERIAL IN INTEGRATED CIRCUIT PACKAGES Public/Granted day:2020-09-17
Information query
IPC分类:
