- 专利标题: Nanowire transistor fabrication with hardmask layers
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申请号: US17228090申请日: 2021-04-12
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公开(公告)号: US11677003B2公开(公告)日: 2023-06-13
- 发明人: Seung Hoon Sung , Seiyon Kim , Kelin J. Kuhn , Willy Rachmady , Jack T. Kavalieros
- 申请人: Sony Group Corporation
- 申请人地址: JP Tokyo
- 专利权人: Sony Group Corporation
- 当前专利权人: Sony Group Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Michael Best & Friedrich LLP
- 分案原申请号: US13996850
- 主分类号: H01L29/10
- IPC分类号: H01L29/10 ; H01L29/66 ; H01L29/06 ; H01L29/786 ; H01L29/423 ; H01L29/775 ; B41F3/46 ; B41F17/08 ; B41N10/04 ; H01L21/033 ; H01L29/78
摘要:
A nanowire device of the present description may be produced with the incorporation of at least one hardmask during the fabrication of at least one nanowire transistor in order to assist in protecting an uppermost channel nanowire from damage that may result from fabrication processes, such as those used in a replacement metal gate process and/or the nanowire release process. The use of at least one hardmask may result in a substantially damage free uppermost channel nanowire in a multi-stacked nanowire transistor, which may improve the uniformity of the channel nanowires and the reliability of the overall multi-stacked nanowire transistor.
公开/授权文献
- US20210257457A1 NANOWIRE TRANSISTOR FABRICATION WITH HARDMASK LAYERS 公开/授权日:2021-08-19
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