发明授权
- 专利标题: Interconnect fabric link width reduction to reduce instantaneous power consumption
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申请号: US17562056申请日: 2021-12-27
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公开(公告)号: US11681349B2公开(公告)日: 2023-06-20
- 发明人: Mohammed Tameem , Altug Koker , Kiran C. Veernapu , Abhishek R. Appu , Ankur N. Shah , Joydeep Ray , Travis T. Schluessler , Jonathan Kennedy
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Jaffery Watson Mendonsa & Hamilton LLP
- 主分类号: G06F1/3234
- IPC分类号: G06F1/3234 ; G06F13/16 ; G06F13/40 ; G06F1/3296 ; G06F1/324 ; G06F1/3206 ; G06F1/3287
摘要:
Described herein are various embodiments of reducing dynamic power consumption within a processor device. One embodiment provides a technique for dynamic link width reduction based on throughput demand for client of an interconnect fabric. One embodiment provides for a parallel processor comprising an interconnect fabric including a dynamically configurable bus widths and frequencies.
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