Invention Grant
- Patent Title: Apparatus and methods for handling die carriers
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Application No.: US17849337Application Date: 2022-06-24
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Publication No.: US11682571B2Publication Date: 2023-06-20
- Inventor: Tsung-Sheng Kuo , Kai-Chieh Huang , Wei-Ting Hsiao , Yang-Ann Chu , I-Lun Yang , Hsuan Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; B65G47/90 ; H01L21/673

Abstract:
Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.
Public/Granted literature
- US20220319890A1 APPARATUS AND METHODS FOR HANDLING DIE CARRIERS Public/Granted day:2022-10-06
Information query
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