公开(公告)号：US20230095609A1

公开(公告)日：2023-03-30

申请号：US18074410

申请日：2022-12-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Yang-Ann Chu ,  Chih-Hung Huang ,  Guan-Wei Huang ,  Jiun-Rong Pai ,  Hsuan Lee

IPC: H01L21/677 ,  B65G1/137 ,  B65G47/90 ,  B65G47/46

Abstract: A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.

公开(公告)号：US11764097B2

公开(公告)日：2023-09-19

申请号：US17308786

申请日：2021-05-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Jian-Hung Cheng ,  M. C. Lin ,  C. C. Chien ,  Hsuan Lee ,  Boris Huang

IPC: H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

CPC classification number: H01L21/6836 ,  H01L21/02043 ,  H01L21/304 ,  H01L22/34 ,  H01L2221/68327

Abstract: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.

公开(公告)号：US11508596B2

公开(公告)日：2022-11-22

申请号：US16886115

申请日：2020-05-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Cheng-Lung Wu ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: G03F1/66 ,  H01L21/677

Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

公开(公告)号：US11348816B2

公开(公告)日：2022-05-31

申请号：US16518250

申请日：2019-07-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Chih-Hung Huang ,  Hsueh-Lei Wang ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: H01L21/677 ,  H01L21/673 ,  B65G1/137

Abstract: In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

公开(公告)号：US20190148200A1

公开(公告)日：2019-05-16

申请号：US15880567

申请日：2018-01-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Hsuan Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Chih-Hung Huang ,  Yang-Ann Chu

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67778 ,  H01L21/67265 ,  H01L21/67724 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775

Abstract: A loading apparatus for processing a wafer cassette containing a plurality of wafers and an operating method thereof are provided. The operating method includes the following steps. The wafer cassette is loaded on a stage of the loading apparatus. The stage is configured to carry the wafer cassette and movably coupled to a main body of the loading apparatus to move within and out of a space of the main body. The stage is vertically moved among a standby position, a lifting position and an intermediate position; horizontally moved from the intermediate position to a door engaging position inside the space; positioned at the door engaging position, and a cassette door of the wafer cassette is opened. The stage is horizontally moved from the door engaging position to the intermediate position, and horizontally moved between the lifting position and an unloading position outside the space after opening the cassette door.

公开(公告)号：US11682571B2

公开(公告)日：2023-06-20

申请号：US17849337

申请日：2022-06-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Kai-Chieh Huang ,  Wei-Ting Hsiao ,  Yang-Ann Chu ,  I-Lun Yang ,  Hsuan Lee

IPC: H01L21/67 ,  H01L21/677 ,  B65G47/90 ,  H01L21/673

CPC classification number: H01L21/67745 ,  B65G47/90 ,  H01L21/67294 ,  H01L21/67333

Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.

公开(公告)号：US11527425B2

公开(公告)日：2022-12-13

申请号：US16731679

申请日：2019-12-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Yang-Ann Chu ,  Chih-Hung Huang ,  Guan-Wei Huang ,  Jiun-Rong Pai ,  Hsuan Lee

IPC: H01L21/677 ,  B65G1/137 ,  B65G47/90 ,  B65G47/46 ,  H01L21/673 ,  H01L21/67

Abstract: A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.

公开(公告)号：US20210375653A1

公开(公告)日：2021-12-02

申请号：US16886115

申请日：2020-05-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Cheng-Lung Wu ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: H01L21/677

Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

公开(公告)号：US11158531B2

公开(公告)日：2021-10-26

申请号：US16714786

申请日：2019-12-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Hsuan Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Chih-Hung Huang ,  Yang-Ann Chu

IPC: H01L21/677 ,  H01L21/67

Abstract: An operating method of a wafer cassette handling apparatus includes at least the following steps. A stage that carries a wafer cassette is moved into a main body of a wafer cassette handling apparatus to open a cassette door of the wafer cassette. The stage that carries the wafer cassette is moved out of the main body after the cassette door is opened. A wafer is extracted from the wafer cassette and transferred to a processing system. Another operating method and a wafer cassette handling apparatus are also provided.

公开(公告)号：US10822181B2

公开(公告)日：2020-11-03

申请号：US16598109

申请日：2019-10-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Chih-Hung Huang ,  Yi-Fam Shiu ,  Chueng-Jen Wang ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: B65G47/86 ,  B65G15/28

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.