Invention Grant
- Patent Title: Packaged electronic circuits having moisture protection encapsulation and methods of forming same
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Application No.: US17060540Application Date: 2020-10-01
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Publication No.: US11682634B2Publication Date: 2023-06-20
- Inventor: Kyle Bothe , Dan Namishia , Fabian Radulescu , Scott Sheppard
- Applicant: Wolfspeed, Inc.
- Applicant Address: US NC Durham
- Assignee: Wolfspeed, Inc.
- Current Assignee: Wolfspeed, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel, P.A.
- The original application number of the division: US15960693 2018.04.24
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/31 ; H01L23/66 ; H01L23/64 ; H01L25/065 ; H01L23/00 ; H01L25/00
Abstract:
A packaged electronic circuit includes a substrate having an upper surface, a first metal layer on the upper surface of the substrate, a first polymer layer on the first metal layer opposite the substrate, a second metal layer on the first polymer layer opposite the first metal layer, a dielectric layer on the first polymer layer and at least a portion of the second metal layer and a second polymer layer on the dielectric layer.
Public/Granted literature
- US20210028127A1 PACKAGED ELECTRONIC CIRCUITS HAVING MOISTURE PROTECTION ENCAPSULATION AND METHODS OF FORMING SAME Public/Granted day:2021-01-28
Information query
IPC分类:
