Invention Grant
- Patent Title: Semiconductor device and methods of forming
-
Application No.: US17216052Application Date: 2021-03-29
-
Publication No.: US11688807B2Publication Date: 2023-06-27
- Inventor: Hung-Tai Chang , Han-Yu Tang , Ming-Hua Yu , Yee-Chia Yeo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/092 ; H01L29/08 ; H01L29/417 ; H01L29/66 ; H01L21/8238

Abstract:
In an embodiment, a device includes a first fin extending from a substrate. The device also includes a first gate stack over and along sidewalls of the first fin. The device also includes a first gate spacer disposed along a sidewall of the first gate stack. The device also includes and a first source/drain region in the first fin and adjacent the first gate spacer, the first source/drain region including a first epitaxial layer on the first fin, the first epitaxial layer having a first dopant concentration of boron. The device also includes and a second epitaxial layer on the first epitaxial layer, the second epitaxial layer having a second dopant concentration of boron, the second dopant concentration being greater than the first dopant concentration.
Public/Granted literature
- US20220131006A1 Semiconductor Device and Methods of Forming Public/Granted day:2022-04-28
Information query
IPC分类: