Invention Grant
- Patent Title: Active regions via contacts having various shaped segments off-set from gate via contact
-
Application No.: US17582357Application Date: 2022-01-24
-
Publication No.: US11705454B2Publication Date: 2023-07-18
- Inventor: Heonjong Shin , Sunghun Jung , Minchan Gwak , Yongsik Jeong , Sangwon Jee , Sora You , Doohyun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co, Ltd.
- Current Assignee: Samsung Electronics Co, Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20180103505 2018.08.31
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/485 ; H01L23/528 ; H01L29/417 ; H01L27/02 ; H01L23/48 ; H01L23/522 ; H01L27/092 ; H01L29/78 ; H01L29/66 ; H01L21/8238

Abstract:
A semiconductor device may include a substrate including an active pattern extending in a first direction, a gate electrode running across the active pattern and extending in a second direction intersecting the first direction, a source/drain pattern on the active pattern and adjacent to a side of the gate electrode, an active contact in a contact hole exposing the source/drain pattern, an insulating pattern filling a remaining space of the contact hole in which the active contact is provided, a first via on the active contact, and a second via on the gate electrode. The active contact may include a first segment that fills a lower portion of the contact hole and a second segment that vertically protrudes from the first segment. The first via is connected to the second segment. The insulating pattern is adjacent in the first direction to the second via.
Public/Granted literature
- US20220149043A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-05-12
Information query
IPC分类: