- 专利标题： Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
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申请号： US16919065申请日： 2020-07-01
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公开(公告)号： US11706516B2公开(公告)日： 2023-07-18
- 发明人: Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
- 申请人： NINGBO SUNNY OPOTECH CO., LTD.
- 申请人地址： CN Zhejiang
- 专利权人： NINGBO SUNNY OPOTECH CO., LTD.
- 当前专利权人： NINGBO SUNNY OPOTECH CO., LTD.
- 当前专利权人地址： CN Zhejiang
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： CN 1610142925.9 2016.03.12 CN 1610143457.7 2016.03.12 CN 1610148338.0 2016.03.15 CN 1610149444.0 2016.03.15
- 分案原申请号： US15075192 2016.03.20
- 主分类号： H04N23/57
- IPC分类号： H04N23/57 ; H01L27/146 ; H04N13/239 ; H04N23/45 ; H04N23/51 ; H04N23/54 ; H04N23/55
摘要：
A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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