Invention Grant
- Patent Title: Electronic component handling apparatus and electronic component testing apparatus
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Application No.: US17358414Application Date: 2021-06-25
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Publication No.: US11714124B2Publication Date: 2023-08-01
- Inventor: Hiromitsu Horino , Yoshitaka Takeuchi , Yoshinori Arai , Hiroyuki Kikuchi
- Applicant: ADVANTEST Corporation
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST Corporation
- Current Assignee: ADVANTEST Corporation
- Current Assignee Address: JP Tokyo
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JP 20124724 2020.07.21
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: transfer units that each include a DUT transfer part that mounts the DUT on a first tray and removes the DUT from the first tray; contact units that each press the DUT mounted on the first tray against a socket disposed on a test head connected to a tester; and a tray transporter that transports the first tray between the contact units and the transfer units. Either or both of (i) at least one of the contact units and (ii) at least one of the transfer units are removably disposed on the electronic component handling apparatus.
Public/Granted literature
- US20220026486A1 ELECTRONIC COMPONENT HANDLING APPARATUS AND ELECTRONIC COMPONENT TESTING APPARATUS Public/Granted day:2022-01-27
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