Invention Grant
- Patent Title: Substrate transfer apparatus
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Application No.: US16996116Application Date: 2020-08-18
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Publication No.: US11721568B2Publication Date: 2023-08-08
- Inventor: Sangho Jang , Dongsoo Lee , Anhi Pyun , Jinyi Lee , Sukbyung Chae
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR 20190170205 2019.12.18
- Main IPC: B65G47/52
- IPC: B65G47/52 ; B65G15/14 ; B65G27/16 ; B65G39/18 ; H01L21/67 ; B65G41/00 ; H01L21/677

Abstract:
The present disclosure relates to a substrate transfer apparatus. The substrate transfer apparatus includes a first transfer apparatus, a second transfer apparatus, a substrate carrier driver, a sensor, a swing apparatus, and a controller. The first transfer apparatus is configured to transfer a substrate in a first direction. The second transfer apparatus is configured to receive the substrate from the first transfer apparatus and transfer the substrate and comprising a substrate carrier on which the substrate transferred from the first transfer apparatus is seated. The substrate carrier driver is configured to move the substrate carrier. The sensor is configured to detect an abnormal transfer of the substrate from the first transfer apparatus to the second transfer apparatus and generate a detection signal corresponding to the abnormal transfer of the substrate. The swing apparatus is configured to swing the substrate carrier. The controller is connected to the sensor and the swing apparatus and configured to control the swing apparatus based on the detection signal of the sensor.
Public/Granted literature
- US20210193491A1 SUBSTRATE TRANSFER APPARATUS Public/Granted day:2021-06-24
Information query
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