Invention Grant
- Patent Title: Integrated semiconductor die vessel processing workstations
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Application No.: US17874174Application Date: 2022-07-26
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Publication No.: US11721572B2Publication Date: 2023-08-08
- Inventor: Tsung-Sheng Kuo , Guan-Wei Huang , Chih-Hung Huang , Yang-Ann Chu , Hsu-Shui Liu , Jiun-Rong Pai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- The original application number of the division: US16518352 2019.07.22
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/66 ; H01L21/02

Abstract:
In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.
Public/Granted literature
- US20220359248A1 INTEGRATED SEMICONDUCTOR DIE VESSEL PROCESSING WORKSTATIONS Public/Granted day:2022-11-10
Information query
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