公开(公告)号：US11508596B2

公开(公告)日：2022-11-22

申请号：US16886115

申请日：2020-05-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Cheng-Lung Wu ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: G03F1/66 ,  H01L21/677

Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

公开(公告)号：US11348816B2

公开(公告)日：2022-05-31

申请号：US16518250

申请日：2019-07-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Chih-Hung Huang ,  Hsueh-Lei Wang ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: H01L21/677 ,  H01L21/673 ,  B65G1/137

Abstract: In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

公开(公告)号：US20200075371A1

公开(公告)日：2020-03-05

申请号：US16518352

申请日：2019-07-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Guan-Wei Huang ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsu-Shui Liu ,  Jiun-Rong Pai

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/66

Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.

公开(公告)号：US20190148200A1

公开(公告)日：2019-05-16

申请号：US15880567

申请日：2018-01-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Hsuan Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Chih-Hung Huang ,  Yang-Ann Chu

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67778 ,  H01L21/67265 ,  H01L21/67724 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775

Abstract: A loading apparatus for processing a wafer cassette containing a plurality of wafers and an operating method thereof are provided. The operating method includes the following steps. The wafer cassette is loaded on a stage of the loading apparatus. The stage is configured to carry the wafer cassette and movably coupled to a main body of the loading apparatus to move within and out of a space of the main body. The stage is vertically moved among a standby position, a lifting position and an intermediate position; horizontally moved from the intermediate position to a door engaging position inside the space; positioned at the door engaging position, and a cassette door of the wafer cassette is opened. The stage is horizontally moved from the door engaging position to the intermediate position, and horizontally moved between the lifting position and an unloading position outside the space after opening the cassette door.

公开(公告)号：US20230095609A1

公开(公告)日：2023-03-30

申请号：US18074410

申请日：2022-12-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Yang-Ann Chu ,  Chih-Hung Huang ,  Guan-Wei Huang ,  Jiun-Rong Pai ,  Hsuan Lee

IPC: H01L21/677 ,  B65G1/137 ,  B65G47/90 ,  B65G47/46

Abstract: A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.

公开(公告)号：US09892948B2

公开(公告)日：2018-02-13

申请号：US15176557

申请日：2016-06-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Jen Lu ,  Ming-Hsien Lee ,  Chih-Hung Huang ,  Chuan-Pu Chen

IPC: H01L21/673

CPC classification number: H01L21/67369

Abstract: A wafer container is provided. The wafer container includes a pod base having a top surface and a bottom surface, a cassette disposed on the top surface, and a damping device, disposed on the bottom surface. The damping device includes a housing disposed in the pod base, and a damping mechanism disposed in the housing and protruding over the bottom surface. The damping mechanism is configured to provide a damping force.

公开(公告)号：US11721572B2

公开(公告)日：2023-08-08

申请号：US17874174

申请日：2022-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Guan-Wei Huang ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsu-Shui Liu ,  Jiun-Rong Pai

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/02

CPC classification number: H01L21/67288 ,  H01L21/02057 ,  H01L21/67051 ,  H01L22/12

Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.

公开(公告)号：US11527425B2

公开(公告)日：2022-12-13

申请号：US16731679

申请日：2019-12-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Yang-Ann Chu ,  Chih-Hung Huang ,  Guan-Wei Huang ,  Jiun-Rong Pai ,  Hsuan Lee

IPC: H01L21/677 ,  B65G1/137 ,  B65G47/90 ,  B65G47/46 ,  H01L21/673 ,  H01L21/67

Abstract: A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.

公开(公告)号：US11488848B2

公开(公告)日：2022-11-01

申请号：US16518352

申请日：2019-07-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng Kuo ,  Guan-Wei Huang ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsu-Shui Liu ,  Jiun-Rong Pai

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/02

Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.

公开(公告)号：US20210375653A1

公开(公告)日：2021-12-02

申请号：US16886115

申请日：2020-05-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Cheng-Lung Wu ,  Chih-Hung Huang ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC: H01L21/677

Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.