Invention Grant
- Patent Title: Structure and formation method of semiconductor device structure with gate stack
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Application No.: US17445692Application Date: 2021-08-23
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Publication No.: US11728376B2Publication Date: 2023-08-15
- Inventor: Chih-Wei Lin , Chih-Lin Wang , Kang-Min Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- The original application number of the division: US15830979 2017.12.04
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/28 ; H01L29/66 ; H01L29/78

Abstract:
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a gate stack over the semiconductor substrate. The gate stack includes a gate dielectric layer and a work function layer. The gate dielectric layer is between the semiconductor substrate and the work function layer. The semiconductor device structure also includes a halogen source layer. The gate dielectric layer is between the semiconductor substrate and the halogen source layer.
Public/Granted literature
- US20210384294A1 STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WITH GATE STACK Public/Granted day:2021-12-09
Information query
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