Invention Grant
- Patent Title: Field effect transistors having ferroelectric or antiferroelectric gate dielectric structure
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Application No.: US16635739Application Date: 2017-09-28
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Publication No.: US11735652B2Publication Date: 2023-08-22
- Inventor: Seiyon Kim , Uygar E. Avci , Joshua M. Howard , Ian A. Young , Daniel H. Morris
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/054164 2017.09.28
- International Announcement: WO2019/066875A 2019.04.04
- Date entered country: 2020-01-31
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/51

Abstract:
Field effect transistors having a ferroelectric or antiferroelectric gate dielectric structure are described. In an example, an integrated circuit structure includes a semiconductor channel structure includes a monocrystalline material. A gate dielectric is over the semiconductor channel structure. The gate dielectric includes a ferroelectric or antiferroelectric polycrystalline material layer. A gate electrode has a conductive layer on the ferroelectric or antiferroelectric polycrystalline material layer, the conductive layer including a metal. A first source or drain structure is at a first side of the gate electrode. A second source or drain structure is at a second side of the gate electrode opposite the first side.
Public/Granted literature
- US20200321446A1 FIELD EFFECT TRANSISTORS HAVING FERROELECTRIC OR ANTIFERROELECTRIC GATE DIELECTRIC STRUCTURE Public/Granted day:2020-10-08
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