Invention Grant
- Patent Title: Semiconductor device and apparatus of manufacturing the same
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Application No.: US17530915Application Date: 2021-11-19
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Publication No.: US11744073B2Publication Date: 2023-08-29
- Inventor: Taisoo Lim , Kyungwook Park , Keun Lee , Hauk Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20190032477 2019.03.21 KR 20190085709 2019.07.16
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H10B43/10 ; H10B43/40 ; H01L29/423 ; H01L21/67 ; H01L21/285 ; H01L21/3213 ; C23C16/56 ; C23C16/455 ; C23C16/06 ; H01L21/28 ; H01L21/02 ; H01L29/66

Abstract:
A semiconductor device includes gate electrodes and interlayer insulating layers that are alternately stacked on a substrate, channel structures spaced apart from each other in a first direction and extending vertically through the gate electrodes and the interlayer insulating layers to the substrate, and a first separation region extending vertically through the gate electrodes and the interlayer insulating layers. Each gate electrode includes a first conductive layer and a second conductive layer, the first conductive layer disposed between the second conductive layer and each of two adjacent interlayer insulating layers. In a first region, between an outermost channel structure and the first separation region, of each gate electrode, the first conductive layer has a decreasing thickness toward the first separation region and the second conductive layer has an increasing thickness toward the first separation region.
Public/Granted literature
- US20220077190A1 SEMICONDUCTOR DEVICE AND APPARATUS OF MANUFACTURING THE SAME Public/Granted day:2022-03-10
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