Invention Grant
- Patent Title: Oligomer, composition, packaging structure, and method of disassembling packaging structure
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Application No.: US17578080Application Date: 2022-01-18
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Publication No.: US11753502B2Publication Date: 2023-09-12
- Inventor: Chi-Fu Tseng , Jauder Jeng , Tien-Shou Shieh , Chin-Hui Chou
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW 0138097 2021.10.14
- Main IPC: C08L79/08
- IPC: C08L79/08 ; C08G63/78
Abstract:
An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of
wherein X is —O—,
and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.
wherein X is —O—,
and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.
Public/Granted literature
- US20230117528A1 OLIGOMER, COMPOSITION, PACKAGING STRUCTURE, AND METHOD OF DISASSEMBLING PACKAGING STRUCTURE Public/Granted day:2023-04-20
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