- 专利标题: MEMS design with shear force rejection for reduced offset
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申请号: US17733495申请日: 2022-04-29
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公开(公告)号: US11761977B1公开(公告)日: 2023-09-19
- 发明人: Varun Subramaniam Kumar , Mrigank Sharma , Giacomo Laghi , Luca Coronato , Matthew Julian Thompson
- 申请人: InvenSense, Inc.
- 申请人地址: US CA San Jose
- 专利权人: InvenSense, Inc.
- 当前专利权人: InvenSense, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Van Hoven PC
- 代理商 Joshua Van Hoven
- 主分类号: G01P15/125
- IPC分类号: G01P15/125 ; G01P15/08
摘要:
A MEMS sensor includes a central anchoring region that maintains the relative position of an attached proof mass relative to sense electrodes in the presence of undesired forces and stresses. The central anchoring region includes one or more first anchors that rigidly couple to a cover substrate and a base substrate. One or more second anchors are rigidly coupled to only the cover substrate and are connected to the one or more first anchors within the MEMS layer via an isolation spring. The proof mass in turn is connected to the one or more second anchors via one or more compliant springs.
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