Invention Grant
- Patent Title: Integration of modulator and laser in a single chip
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Application No.: US16989907Application Date: 2020-08-11
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Publication No.: US11764543B2Publication Date: 2023-09-19
- Inventor: Vladimir Iakovlev , Yuri Berk , Paraskevas Bakopoulos , Elad Mentovich
- Applicant: MELLANOX TECHNOLOGIES, LTD.
- Applicant Address: IL Yokneam
- Assignee: MELLANOX TECHNOLOGIES, LTD.
- Current Assignee: MELLANOX TECHNOLOGIES, LTD.
- Current Assignee Address: IL Yokneam
- Agency: KLIGER & ASSOCIATES PATENT ATTORNEYS LTD
- Priority: GR 200100207 2020.04.23
- Main IPC: H01S5/183
- IPC: H01S5/183 ; H01S5/026 ; H01S5/02255 ; H01S5/343 ; G02F1/21 ; H01S5/00 ; H01S5/30

Abstract:
An optoelectronic device includes a substrate and first thin film layers disposed on the substrate and patterned to define a vertical-cavity surface-emitting laser (VCSEL), which is configured to emit optical radiation along an optical axis perpendicular to the substrate. Second thin film layers are disposed over the first thin film layers and are patterned to define an optical modulator in which the optical radiation propagates in a direction parallel to the substrate, and an optical coupler configured to couple the optical radiation from the VCSEL into the optical modulator.
Public/Granted literature
- US20210336418A1 Integration of modulator and laser in a single chip Public/Granted day:2021-10-28
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