Invention Grant
- Patent Title: Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap
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Application No.: US17669288Application Date: 2022-02-10
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Publication No.: US11776821B2Publication Date: 2023-10-03
- Inventor: Ziyin Lin , Vipul Mehta , Edvin Cetegen , Yuying Wei , Sushrutha Gujjula , Nisha Ananthakrishnan , Shan Zhong
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/67 ; H01L23/00 ; H01L23/31 ; H01L23/13
Abstract:
A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. An encapsulant is over the protrusion of the substrate, the encapsulant extending beneath the first die, and the encapsulant extending beneath the second die.
Public/Granted literature
Information query
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