Invention Grant
- Patent Title: Semiconductor package
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Application No.: US17357378Application Date: 2021-06-24
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Publication No.: US11776941B2Publication Date: 2023-10-03
- Inventor: Yonghoe Cho , Sunkyoung Seo , Chajea Jo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20200135421 2020.10.19
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/16 ; H01L23/14 ; H01L23/00 ; H01L23/538

Abstract:
A semiconductor package includes a package substrate, a connection substrate on the package substrate, a first image sensor chip on the connection substrate, a second image sensor chip on the connection substrate, the second image sensor chip being horizontally spaced apart from the first image sensor chip, and a memory chip disposed on the package substrate and electrically connected to the first image sensor chip through the connection substrate. A distance between the first image sensor chip and the second image sensor chip is less than a thickness of the first image sensor chip.
Public/Granted literature
- US20220122955A1 SEMICONDUCTOR PACKAGE Public/Granted day:2022-04-21
Information query
IPC分类: