公开(公告)号：US11776947B2

公开(公告)日：2023-10-03

申请号：US17206656

申请日：2021-03-19

Applicant: TDK CORPORATION

Inventor： Yusuke Oba ,  Kenichi Yoshida ,  Takashi Ohtsuka ,  Yuichiro Okuyama ,  Tomoya Hanai ,  Yu Fukae

IPC: H01L25/18 ,  H01L27/01 ,  H01L21/70 ,  H01L21/78 ,  H01L49/02

CPC classification number: H01L25/18 ,  H01L21/707 ,  H01L21/78 ,  H01L27/016 ,  H01L28/10 ,  H01L28/40

Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.