- Patent Title: Apparatuses including band offset materials, and related systems
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Application No.: US17140494Application Date: 2021-01-04
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Publication No.: US11778824B2Publication Date: 2023-10-03
- Inventor: Albert Fayrushin , Haitao Liu , Mojtaba Asadirad
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H01L29/10 ; H01L23/522 ; H01L23/528 ; H01L21/02 ; H01L21/768 ; H01L23/532 ; G11C16/04 ; G11C16/10 ; G11C16/26 ; G11C16/14

Abstract:
A semiconductor device comprises a stack comprising an alternating sequence of dielectric structures and conductive structures, and a channel structure within an opening vertically extending through the stack and comprising a first semiconductor material having a first band gap. The semiconductor device also comprises a conductive plug structure within the opening and in direct contact with the channel region, and a band offset structure within the opening and in direct physical contact with the channel structure and the conductive plug structure. The band offset structure comprises a second semiconductor material having a second band gap different than the first band gap. The semiconductor device further comprises a conductive line structure electrically coupled to the conductive plug structure. A method of forming a semiconductor device and an electronic system are also described.
Public/Granted literature
- US20210151464A1 APPARATUSES INCLUDING BAND OFFSET MATERIALS, AND RELATED SYSTEMS Public/Granted day:2021-05-20
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