Invention Grant
- Patent Title: Compensation for substrate doping for in-situ electromagnetic inductive monitoring
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Application No.: US16440785Application Date: 2019-06-13
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Publication No.: US11780045B2Publication Date: 2023-10-10
- Inventor: Wei Lu , David Maxwell Gage , Harry Q. Lee , Kun Xu , Jimin Zhang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B37/005
- IPC: B24B37/005 ; G01B7/06 ; B24B49/10 ; B24B37/27

Abstract:
A method of chemical mechanical polishing includes bringing a substrate having a conductive layer disposed over a semiconductor wafer into contact with a polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, determining a sequence of thickness values for the conductive layer based on the sequence of signal values, and at least partially compensating for a contribution of conductivity of the semiconductor wafer to the signal values.
Public/Granted literature
- US20190389028A1 COMPENSATION FOR SUBSTRATE DOPING FOR IN-SITU ELECTROMAGNETIC INDUCTIVE MONITORING Public/Granted day:2019-12-26
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