Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US17393025Application Date: 2021-08-03
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Publication No.: US11784186B2Publication Date: 2023-10-10
- Inventor: Sang Min Yoo , Ju Youn Kim , Hyung Joo Na , Bong Seok Suh , Joo Ho Jung , Eui Chui Hwang , Sung Moon Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20180090608 2018.08.03
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/40 ; H01L21/762 ; H01L29/78

Abstract:
A semiconductor device includes a first active pattern extending lengthwise along a first direction and a second active pattern extending lengthwise along the first direction and spaced apart from the first active pattern in the first direction. The device also includes a field insulating film between the first active pattern and the second active pattern. An upper surface of the field insulating film is lower than or coplanar with upper surfaces of the first and second active patterns. The device further includes an element isolation structure in an isolation trench in the first active pattern and the field insulating film. An upper surface of the element isolation structure is higher than the upper surfaces of the first and second active patterns.
Public/Granted literature
- US20210366905A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-11-25
Information query
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