An ink impact point correction apparatus for automatically measuring and correcting an impact point of ink using a pattern on a substrate, on which a coordinate system is displayed, and a substrate treating system including the same are provided. The ink impact point correction apparatus includes a recognition unit for acquiring information on the impact point of ink at a plurality of points located on a substrate; and a correction unit for correcting a position of an ink discharge point on the substrate based on the information on the impact point, wherein a coordinate pattern in the form of a coordinate system is formed at the plurality of points.