Invention Grant
- Patent Title: Polishing composition and polishing method
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Application No.: US15129838Application Date: 2015-03-30
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Publication No.: US11791164B2Publication Date: 2023-10-17
- Inventor: Takayuki Matsushita , Tomoki Yamasaki
- Applicant: NITTA HAAS INCORPORATED
- Applicant Address: JP Osaka
- Assignee: NITTA DUPONT INCORPORATED
- Current Assignee: NITTA DUPONT INCORPORATED
- Current Assignee Address: JP Osaka
- Agency: Clark & Brody LP
- Priority: JP 14073790 2014.03.31
- International Application: PCT/JP2015/059924 2015.03.30
- International Announcement: WO2015/152151A 2015.10.08
- Date entered country: 2016-09-28
- Main IPC: H01L21/321
- IPC: H01L21/321 ; C09G1/02 ; H01L21/02 ; H01L21/3105
Abstract:
The present invention relates to a polishing composition including water and silica, wherein the silica has a BET specific surface area of 30 m2/g or more and an NMR specific surface area of 10 m2/g or more, and a polishing method using the polishing composition. The polishing composition of the present invention adopts silica having the BET specific surface area falling within the above-described range, and additionally having the NMR specific surface area falling within a specific range, and consequently attains a high polishing rate, and can maintain the polishing rate even when used for a long time.
Public/Granted literature
- US20170178926A1 POLISHING COMPOSITION AND POLISHING METHOD Public/Granted day:2017-06-22
Information query
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