公开(公告)号：US11791164B2

公开(公告)日：2023-10-17

申请号：US15129838

申请日：2015-03-30

Applicant: NITTA HAAS INCORPORATED

Inventor： Takayuki Matsushita ,  Tomoki Yamasaki

IPC: H01L21/321 ,  C09G1/02 ,  H01L21/02 ,  H01L21/3105

CPC classification number: H01L21/3212 ,  C09G1/02 ,  H01L21/02024 ,  H01L21/31053

Abstract: The present invention relates to a polishing composition including water and silica, wherein the silica has a BET specific surface area of 30 m2/g or more and an NMR specific surface area of 10 m2/g or more, and a polishing method using the polishing composition. The polishing composition of the present invention adopts silica having the BET specific surface area falling within the above-described range, and additionally having the NMR specific surface area falling within a specific range, and consequently attains a high polishing rate, and can maintain the polishing rate even when used for a long time.