- 专利标题： Device on ceramic substrate
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申请号： US17017407申请日： 2020-09-10
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公开(公告)号： US11791226B2公开(公告)日： 2023-10-17
- 发明人: Je-Hsiung Lan , Ranadeep Dutta , Jonghae Kim
- 申请人： QUALCOMM Incorporated
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM INCORPORATED
- 当前专利权人： QUALCOMM INCORPORATED
- 当前专利权人地址： US CA San Diego
- 代理机构： Muncy, Geissler, Olds & Lowe, P.C.
- 主分类号： H01L23/15
- IPC分类号： H01L23/15 ; H01L21/768 ; H01L21/321 ; H01L21/48 ; H01L23/522 ; H01L23/373 ; C04B35/111 ; C04B37/02 ; H03H9/10 ; H03H3/10 ; H01L27/06 ; H03H3/02
摘要：
Disclosed are devices and methods for semiconductor devices including a ceramic substrate. Aspects disclosed include semiconductor device including an electrical component, an alumina ceramic substrate and a substrate-film. The substrate-film is deposited on the alumina ceramic substrate. The substrate-film has a planar substrate-film surface opposite the alumina ceramic substrate. The electrical component is formed on the substrate-film surface of the substrate-film on the alumina ceramic substrate.
公开/授权文献
- US20210098319A1 DEVICE ON CERAMIC SUBSTRATE 公开/授权日：2021-04-01
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