Invention Grant
- Patent Title: Conductive lines with subtractive cuts
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Application No.: US17679719Application Date: 2022-02-24
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Publication No.: US11791258B2Publication Date: 2023-10-17
- Inventor: Brent Anderson , Lawrence A. Clevenger , Kisik Choi , Nicholas Anthony Lanzillo , Christopher J. Penny , Robert Robison
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Randy Emilio Tejeda
- The original application number of the division: US16749476 2020.01.22
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/768 ; H01L23/528 ; H01L21/311
Abstract:
Integrated chips include a dielectric layer that includes at least one trench and at least one plug region. A line is formed in the dielectric layer in the at least one trench and terminates at the plug region. A dielectric plug is formed in the plug region.
Public/Granted literature
- US20220181255A1 CONDUCTIVE LINES WITH SUBTRACTIVE CUTS Public/Granted day:2022-06-09
Information query
IPC分类:
