Invention Grant
- Patent Title: Dielectric and metallic nanowire bond layers
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Application No.: US17544888Application Date: 2021-12-07
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Publication No.: US11791296B2Publication Date: 2023-10-17
- Inventor: Scott Robert Summerfelt , Benjamin Stassen Cook , Ralf Jakobskrueger Muenster , Sreenivasan Kalyani Koduri
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.
Public/Granted literature
- US20220102307A1 DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS Public/Granted day:2022-03-31
Information query
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