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公开(公告)号:US11791296B2
公开(公告)日:2023-10-17
申请号:US17544888
申请日:2021-12-07
发明人: Scott Robert Summerfelt , Benjamin Stassen Cook , Ralf Jakobskrueger Muenster , Sreenivasan Kalyani Koduri
IPC分类号: H01L23/00
CPC分类号: H01L24/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/13005 , H01L2224/13023 , H01L2224/13026 , H01L2224/13078 , H01L2224/279 , H01L2224/29078 , H01L2224/3207 , H01L2224/83895 , H01L2224/83896
摘要: In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.
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公开(公告)号:US11239195B2
公开(公告)日:2022-02-01
申请号:US16843580
申请日:2020-04-08
IPC分类号: H01L23/31 , H01L21/78 , H01L23/495 , H01L23/00
摘要: In some examples, a system comprises a first component having a first surface, a first set of nanoparticles coupled to the first surface, and a first set of nanowires extending from the first set of nanoparticles. The system also comprises a second component having a second surface, a second set of nanoparticles coupled to the second surface, and a second set of nanowires extending from the second set of nanoparticles. The system further includes an adhesive positioned between the first and second surfaces. The first and second sets of nanowires are positioned within the adhesive.
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公开(公告)号:US11282807B2
公开(公告)日:2022-03-22
申请号:US16843559
申请日:2020-04-08
IPC分类号: H01L23/00 , H01L23/367 , H01L23/15 , H01L23/495 , H01L23/373
摘要: In some examples, a system comprises a set of nanoparticles and a set of nanowires extending from the set of nanoparticles.
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公开(公告)号:US11728242B2
公开(公告)日:2023-08-15
申请号:US16843618
申请日:2020-04-08
IPC分类号: H01L23/48 , H01L21/768 , H01L23/495 , H01L23/00 , H01L21/288
CPC分类号: H01L23/481 , H01L21/76898 , H01L23/49575 , H01L24/32 , H01L24/33 , H01L24/73 , H01L21/2885 , H01L2224/32146 , H01L2224/73265
摘要: In some examples, a semiconductor package comprises a semiconductor die having a first surface and a second surface opposing the first surface. The package comprises an orifice extending through a thickness of the semiconductor die from the first surface to the second surface. The package comprises a set of metallic nanowires positioned within the orifice and extending through the thickness of the semiconductor die from the first surface to the second surface.
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公开(公告)号:US11714011B2
公开(公告)日:2023-08-01
申请号:US16843659
申请日:2020-04-08
摘要: A system comprises a member to receive a mechanical force, and a sensor to sense the mechanical force. The sensor is mounted on the member using a set of nanoparticles and a set of nanowires coupled to the set of nanoparticles.
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公开(公告)号:US11195811B2
公开(公告)日:2021-12-07
申请号:US16843717
申请日:2020-04-08
发明人: Scott Robert Summerfelt , Benjamin Stassen Cook , Ralf Jakobskrueger Muenster , Sreenivasan Kalyani Koduri
IPC分类号: H01L23/00
摘要: In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.
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