Invention Grant
- Patent Title: Memory arrays and methods used in forming a memory array comprising strings of memory cells
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Application No.: US17567287Application Date: 2022-01-03
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Publication No.: US11792991B2Publication Date: 2023-10-17
- Inventor: Paolo Tessariol , Justin B. Dorhout , Jian Li , Ryan L. Meyer
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- The original application number of the division: US16550244 2019.08.25
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/522 ; H10B43/27 ; H01L23/528 ; H10B41/27 ; H10B41/35 ; H10B43/35

Abstract:
A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Operative channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. Insulative pillars are laterally-between and longitudinally-spaced-along immediately-laterally-adjacent of the memory blocks. The pillars are directly against conducting material of conductive lines in the conductive tiers. Other arrays, and methods, are disclosed.
Public/Granted literature
- US20220130857A1 Memory Arrays And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells Public/Granted day:2022-04-28
Information query
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