- 专利标题: Micro-electro-mechanical system (MEMS) thermal sensor
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申请号: US17216047申请日: 2021-03-29
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公开(公告)号: US11796396B2公开(公告)日: 2023-10-24
- 发明人: Tsai-Hao Hung , Shih-Chi Kuo
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- 分案原申请号: US16408769 2019.05.10
- 主分类号: B81B5/00
- IPC分类号: B81B5/00 ; G01K7/32 ; B81B3/00 ; B81C1/00
摘要:
The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.
公开/授权文献
- US20210215550A1 MICRO-ELECTRO-MECHANICAL SYTEM (MEMS) THERMAL SENSOR 公开/授权日:2021-07-15
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