Invention Grant
- Patent Title: Self-aligned trench MOSFET
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Application No.: US17238504Application Date: 2021-04-23
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Publication No.: US11798982B2Publication Date: 2023-10-24
- Inventor: Qintao Zhang , Samphy Hong , Jason Appell , David J. Lee
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: KDW Firm PLLC
- Main IPC: H01L21/04
- IPC: H01L21/04 ; H01L29/06 ; H01L29/16 ; H01L29/10 ; H01L29/66 ; H01L21/76 ; H01L21/761 ; H01L29/78

Abstract:
Methods may include providing a device structure including a well formed in an epitaxial layer, and forming a plurality of shielding layers in the device structure, wherein at least one shielding layer is formed between a pair of adjacent sacrificial gates of a plurality of sacrificial gates. The method may further include forming a contact over the at least one shielding layer, forming a fill layer over the contact, and forming a plurality of trenches into the device structure, wherein at least one trench of the plurality of trenches is formed between a pair of adjacent shielding layers of the plurality of shielding layers, and wherein the at least one trench of the plurality of trenches is defined in part by a sidewall of the fill layer. The method may further include forming a gate structure within the at least one trench of the plurality of trenches.
Public/Granted literature
- US20220344453A1 SELF-ALIGNED TRENCH MOSFET Public/Granted day:2022-10-27
Information query
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