Invention Grant
- Patent Title: Electrically conductive adhesive
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Application No.: US17495409Application Date: 2021-10-06
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Publication No.: US11802221B2Publication Date: 2023-10-31
- Inventor: Jing Fang , Dong Yang , Jeffrey W. McCutcheon
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Clifton F. Richardson
- The original application number of the division: US16497042
- Main IPC: H01B1/22
- IPC: H01B1/22 ; C09J9/02 ; C09J201/02

Abstract:
An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive dendritic first particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 20 micrometers to about 40 micrometers; and a plurality of electrically conductive substantially planar second particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 40 micrometers to about 70 micrometers. The adhesive layer has an average thickness in a range from about 15 micrometers to about 35 micrometers, an electrical resistance in a thickness direction of less than about 30 milliohms, and a peel strength of at least 0.1 N/mm from a stainless steel surface after a dwell time of about 20 minutes at 22° C.
Public/Granted literature
- US20220025225A1 ELECTRICALLY CONDUCTIVE ADHESIVE Public/Granted day:2022-01-27
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