Invention Grant
- Patent Title: Deposition apparatus methods for sequential workpiece coating
-
Application No.: US17145869Application Date: 2021-01-11
-
Publication No.: US11802339B2Publication Date: 2023-10-31
- Inventor: James W. Neal , David A. Litton , Brian T. Hazel , Michael J. Maloney , Eric M. Jorzik
- Applicant: Raytheon Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: RTX Corporation
- Current Assignee: RTX Corporation
- Current Assignee Address: US CT Farmington
- Agency: Bachman & LaPointe, P.C.
- The original application number of the division: US14736834 2015.06.11
- Main IPC: C23C14/22
- IPC: C23C14/22 ; C23C16/46 ; C23C16/455 ; C23C16/458 ; C23C14/50 ; C23C14/56 ; C23C14/08 ; C23C14/30 ; C23C14/02 ; C23C14/58

Abstract:
A deposition apparatus comprises: an infeed chamber; a preheat chamber; a deposition chamber; and optionally at least one of a cooldown chamber and an outlet chamber. At least a first of the preheat chamber and the cooldown chamber contains a buffer system for buffering workpieces respectively passing to or from the deposition chamber.
Public/Granted literature
- US20210130959A1 Deposition Apparatus and Use Methods Public/Granted day:2021-05-06
Information query
IPC分类: