公开(公告)号：US20210130959A1

公开(公告)日：2021-05-06

申请号：US17145869

申请日：2021-01-11

Applicant: Raytheon Technologies Corporation

Inventor： James W. Neal ,  David A. Litton ,  Brian T. Hazel ,  Michael J. Maloney ,  Eric M. Jorzik

IPC: C23C16/46 ,  C23C14/22 ,  C23C16/455 ,  C23C16/458 ,  C23C14/50 ,  C23C14/56

Abstract: A deposition apparatus comprises: an infeed chamber; a preheat chamber; a deposition chamber; and optionally at least one of a cooldown chamber and an outlet chamber. At least a first of the preheat chamber and the cooldown chamber contains a buffer system for buffering workpieces respectively passing to or from the deposition chamber.

公开(公告)号：US11802339B2

公开(公告)日：2023-10-31

申请号：US17145869

申请日：2021-01-11

Applicant: Raytheon Technologies Corporation

Inventor： James W. Neal ,  David A. Litton ,  Brian T. Hazel ,  Michael J. Maloney ,  Eric M. Jorzik

IPC: C23C14/22 ,  C23C16/46 ,  C23C16/455 ,  C23C16/458 ,  C23C14/50 ,  C23C14/56 ,  C23C14/08 ,  C23C14/30 ,  C23C14/02 ,  C23C14/58

CPC classification number: C23C16/463 ,  C23C14/083 ,  C23C14/22 ,  C23C14/50 ,  C23C14/505 ,  C23C14/56 ,  C23C14/566 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C14/02 ,  C23C14/30 ,  C23C14/58

Abstract: A deposition apparatus comprises: an infeed chamber; a preheat chamber; a deposition chamber; and optionally at least one of a cooldown chamber and an outlet chamber. At least a first of the preheat chamber and the cooldown chamber contains a buffer system for buffering workpieces respectively passing to or from the deposition chamber.