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公开(公告)号：US20220316048A1
公开(公告)日：2022-10-06
申请号：US17844199
申请日：2022-06-20
Applicant: Raytheon Technologies Corporation
Inventor： Brian T. Hazel , Michael J. Maloney , James W. Neal , David A. Litton
Abstract: A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns;
a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.-
Patent Agency Ranking
公开(公告)号：US20210130959A1
公开(公告)日：2021-05-06
申请号：US17145869
申请日：2021-01-11
Applicant: Raytheon Technologies Corporation
Inventor： James W. Neal , David A. Litton , Brian T. Hazel , Michael J. Maloney , Eric M. Jorzik
IPC: C23C16/46 , C23C14/22 , C23C16/455 , C23C16/458 , C23C14/50 , C23C14/56
Abstract: A deposition apparatus comprises: an infeed chamber; a preheat chamber; a deposition chamber; and optionally at least one of a cooldown chamber and an outlet chamber. At least a first of the preheat chamber and the cooldown chamber contains a buffer system for buffering workpieces respectively passing to or from the deposition chamber.
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公开(公告)号：US20200332409A1
公开(公告)日：2020-10-22
申请号：US16919569
申请日：2020-07-02
Applicant: Raytheon Technologies Corporation
Inventor： James W. Neal , Brian T. Hazel , David A. Litton , Eric Jorzik
Abstract: A system for depositing coating on a workpiece includes a deposition chamber within which is formed a vortex to at least partially surround a workpiece therein.
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公开(公告)号：US11802339B2
公开(公告)日：2023-10-31
申请号：US17145869
申请日：2021-01-11
Applicant: Raytheon Technologies Corporation
Inventor： James W. Neal , David A. Litton , Brian T. Hazel , Michael J. Maloney , Eric M. Jorzik
IPC: C23C14/22 , C23C16/46 , C23C16/455 , C23C16/458 , C23C14/50 , C23C14/56 , C23C14/08 , C23C14/30 , C23C14/02 , C23C14/58
CPC classification number: C23C16/463 , C23C14/083 , C23C14/22 , C23C14/50 , C23C14/505 , C23C14/56 , C23C14/566 , C23C16/455 , C23C16/458 , C23C16/46 , C23C14/02 , C23C14/30 , C23C14/58
Abstract: A deposition apparatus comprises: an infeed chamber; a preheat chamber; a deposition chamber; and optionally at least one of a cooldown chamber and an outlet chamber. At least a first of the preheat chamber and the cooldown chamber contains a buffer system for buffering workpieces respectively passing to or from the deposition chamber.
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公开(公告)号：US11542593B2
公开(公告)日：2023-01-03
申请号：US16919569
申请日：2020-07-02
Applicant: Raytheon Technologies Corporation
Inventor： James W. Neal , Brian T. Hazel , David A. Litton , Eric Jorzik
Abstract: A system for depositing coating on a workpiece includes a deposition chamber within which is formed a vortex to at least partially surround a workpiece therein.
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公开(公告)号：US11725269B2
公开(公告)日：2023-08-15
申请号：US17844199
申请日：2022-06-20
Applicant: Raytheon Technologies Corporation
Inventor： Brian T. Hazel , Michael J. Maloney , James W. Neal , David A. Litton
CPC classification number: C23C14/30 , C23C14/228 , C23C14/243 , C23C14/246 , C23C14/505
Abstract: A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns; a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.
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