Invention Grant
- Patent Title: Electronic component testing apparatus, sockets, and replacement parts for electronic component testing apparatus
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Application No.: US17104913Application Date: 2020-11-25
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Publication No.: US11802904B2Publication Date: 2023-10-31
- Inventor: Natsuki Shiota , Hiroyuki Mineo
- Applicant: ADVANTEST Corporation
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST Corporation
- Current Assignee: ADVANTEST Corporation
- Current Assignee Address: JP Tokyo
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JP 19232547 2019.12.24
- Main IPC: G01R31/30
- IPC: G01R31/30 ; G01R31/28 ; G01R29/10 ; G01R1/04 ; G01R1/067 ; G01R1/073

Abstract:
An electronic component testing apparatus is used for testing a device under test (DUT). The electronic component testing apparatus includes: a socket unit that is electrically connected to the DUT; a first wiring board; and a tester that comprises a test head in which the first wiring board is mounted. The socket unit includes a first socket and a second socket. The second socket includes a base and a test antenna unit. The tester tests the DUT by transmitting and receiving radio waves between a device antenna unit of the DUT and the test antenna unit while the DUT is electrically connected to the first socket and the first socket is electrically connected to the test head through the second socket.
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