Invention Grant
- Patent Title: Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions
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Application No.: US16246311Application Date: 2019-01-11
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Publication No.: US11804418B2Publication Date: 2023-10-31
- Inventor: Nicholas Neal , Je-Young Chang , Jae Kim , Ravindranath Mahajan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/433 ; F28F3/12 ; F28F9/00 ; H01L23/367 ; H01L23/473 ; F28F9/02 ; F28D21/00

Abstract:
A heat exchange module, comprising an array of microchannels, where the array of microchannels extends in a first direction, and are separated from one another by a first sidewall. The array of microchannels is over a cold plate. A first array of fluid distribution channels is stacked over the array of microchannels and extend in a second direction that is substantially orthogonal to the first direction. The first array of fluid distribution channels extends from the first manifold and terminate between a first manifold and a second manifold. A second array of fluid distribution channels is stacked over the array of microchannels. The first array of fluid distribution channels and the second array of the fluid distribution channels are fluidically coupled to the microchannel array. A wall extends into the microchannel array below a second sidewall separating ones of the first array and ones of the second array of fluid distribution channels.
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